In the LED panel lamp, there are three basic stages of heat transfer, from integrated chip to epitaxy, from packaging base steel plate to heat sink or shell. At present, the technical problem of LED heat dissipation is that led nodes are limited by temperature. High temperature will cause led integrated chip, luminous powder, packaging epoxy resin service life is reduced. In order to keep the advantages of high efficiency and long life of LED, the junction temperature of LED must be controlled.

So the selection of thermal conductive materials to deal with the technical problems of heat dissipation seems particularly important. In which the selection of thermal conductive materials is also led panel lamps must be considered at the beginning of the design, is a basic step, so the selection of thermal conductive materials is a step of high efficiency and long life of LED lighting lamps.

LED lamps have the advantages of zero pollution, low power consumption and green

Market application in all walks of life. The current LED purification lamp shell is generally composed of lamp cover and base. The lamp cover covers the base, and the connecting parts between the lamp cover and the base must be connected seamlessly to ensure that the lamp source will not be harmed by environmental factors, so that the light source can radiate into the indoor space more gently and evenly.

In addition, due to the heavy metal installation, the base of the LED is not made of heavy metal. On the lamp, it is also a risk of electric shock.

Because the LED panel lamp can not choose the cooling fan or the natural heat convection method to heat it, moreover, the electronic optical requirements of LED lighting must be considered in the LED heat dissipation design scheme. In addition, the LED heat dissipation design scheme must meet the requirements of lighting fixture modeling design. Only in this way can led lighting lamps have stronger product selling points, and the lighting lamp modeling design limits the heat dissipation design scheme of LED.

If in order to facilitate the decentralized sorting of heat dissipation lamp sources, thereby reducing the electron optical efficiency, it will be a little bit of a loss for the small. Because the cost of LED heat dissipation is very high, the volume and net weight of LED lighting lamps can not be filled with a lot of high thermal conductivity materials.

Thermal conductive materials include: high thermal conductivity silicon film, thermal conductive silicone grease, thermal conductive phase change materials and so on. Among them, thermal conductive silica gel sheet and high thermal conductivity silicone gasket have high cost performance, which is the preferred raw material for heat transfer and heat dissipation.

Source: Bihua lighting http://www.zsbihualed.com